TYPE | DESCRIPTION |
Factory Lead Time | 8 Weeks |
Package / Case | 357-BBGA |
Surface Mount | YES |
Operating Temperature | 0°C~70°C TA |
Packaging | Tray |
Series | M683xx |
Published | 1995 |
JESD-609 Code | e1 |
Part Status | Last Time Buy |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 357 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 5V |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MC68EN360 |
JESD-30 Code | S-PBGA-B357 |
Supply Voltage-Max (Vsup) | 5.25V |
Supply Voltage-Min (Vsup) | 4.75V |
Number of I/O | 46 |
Speed | 25MHz |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | CPU32+ |
Clock Frequency | 6MHz |
Bit Size | 32 |
Has ADC | NO |
DMA Channels | YES |
PWM Channels | NO |
Address Bus Width | 32 |
External Data Bus Width | 32 |
Voltage - I/O | 5.0V |
Ethernet | 10Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | DRAM |
Additional Interfaces | SCC, SMC, SPI |
Co-Processors/DSP | Communications; CPM |
Length | 25mm |
Height Seated (Max) | 1.86mm |
RoHS Status | ROHS3 Compliant |