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MC9S08DZ96CLL

  • MC9S08DZ96CLL
  • MC9S08DZ96CLL
MC9S08DZ96CLL
Microcontrollers
NXP USA Inc.
96KB 96K x 8 F
-
100-LQFP
YES
TYPEDESCRIPTION
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Series S08
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S08DZ96
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3/5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type External
Number of I/O 87
Speed 40MHz
RAM Size 6K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 38.4MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 96KB 96K x 8
Connectivity CANbus, I2C, LINbus, SCI, SPI
Supply Current-Max 24mA
Bit Size 8
Data Converter A/D 24x12b
Has ADC YES
DMA Channels NO
PWM Channels YES
Address Bus Width 16
ROM (words) 98304
EEPROM Size 2K x 8
Length 14mm
Width 14mm
RoHS Status ROHS3 Compliant

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